Thin Layer Deposition equipment market, like any other manufacturing equipment industry, has been posting uneven performances, largely tied to the economic fortunes of the world. Given its high-strung sensitivity to the health of key end-use segments such as the semiconductors, optoelectronics, industrial applications and specialty packaging among others, world market for thin layer deposition equipment traversed through a rough patch during 2008-2010, as the economic recession held back production and development in the aforementioned sectors during the period.
Semiconductor industry, one of the major end-use segments for thin film deposition suffered the worst in the 2007-2009 recession, thereby squeezing opportunities in the global thin layer deposition equipment market during the period. Fortunes in the semiconductor industry are closely tied to industrial electronics, automotive electronics, consumer electronics, wireless communications, wired communications and data processing technologies, all of which witnessed significant disruptions in business activity/prospects. As a result of the financial crisis and lack of credit availability, semiconductor foundries, and fabrication plants reined in capital spending, thus impacting demand for semiconductor manufacturing equipment including thin layer deposition equipment. In addition to depressed demand conditions in microelectronics, storage and optics end-use sectors, the market for thin layer deposition equipment was also impacted by the soft business climate in other application sectors such as, cutting tools, industrial, and specialty packaging. Slowing levels of economic activity as a result of reduced manufacturing and commercial activity, declines in industrial production, weak business confidence, shortages of credit availability to finance investments in new machinery, technologies, new plant establishments, upgradation, renovations and refurbishments, all represented common woes that cut through these end-use sectors.
Post recession, renewed emphasis on tapping into growth opportunities in the chip industry will elicit a shift in focus away from cost reduction towards technology innovation, with ensuing benefits echoing downstream into the market for thin layer deposition equipment. Semiconductor fabrication plants are expected to resume investments in purchasing equipment required to ensure relevance and sustainability as the chip industry continues to move up to the next generation in IC manufacturing. Additionally, the already surfacing electronic component shortages as a result of the hitherto cutting back on production lines and investments in fabrications plants, will spur demand over the next few years. In conclusion, shortages of resistors, motherboard components and microprocessors, among others will help jumpstart investments in semiconductor manufacturing equipment, including thin layer deposition equipment.
Increasing demand for LEDs, especially from developing markets such as Asia, will make opto-electronics another key sector that will help drive demand for thin layer deposition equipment in the post recession period. Given the growing use of LEDs as backlights in computers and flat panel displays, LED manufacturers are expected to increase their capital investments for expanding LED production, which augurs well for the market Growing demand for solar energy and subsequent increase in production of solar panels, against the backdrop of increased focus on energy conservation and the need for sustainable and low-cost energy production will also create numerous opportunities for thin layer deposition equipment in the energy segment. Policies such as US Government?s Green New Deal, which encourages solar energy generation, will also offer good market prospects for thin layer deposition equipment in this segment.
As stated by the new market research report on Thin Layer Deposition Equipment, Asia-Pacific represents the largest regional market. By technology physical vapor deposition (PVD) equipment represents the largest segment. Unlike the diversified PVD industry, CVD industry is much more concentrated on high-tech applications of microelectronic components such as semiconductors and opto-electronic components, aerospace and medical technology. Global revenues for chemical vapor deposition (CVD) equipment market are expected to surge at a CAGR of more than 10% over the analysis period.
Major players in the marketplace include AIXTRON SE, Applied Materials Inc., ASM International N.V., Canon ANELVA Corporation, CHA Industries, CVD Equipment Corporation, Denton Vacuum LLC, Edwards Limited, Ionbond AG, Jusung Engineering Co. Ltd., KDF Electronic & Vacuum Services Inc., Kokusai Semiconductor Equipment Corporation, Novellus Systems Inc., OC Oerlikon Corporation AG, OEM Group, RIBER SA, Seki Technotron USA, Silicon Genesis Corporation, Tecvac Ltd, Ti-Coating Inc., Tokyo Electron Limited, Ultramet, ULVAC Technologies Inc., Vapor Technologies Inc., and Veeco Instruments.
The research report titled ?Thin Layer Deposition Equipment: A Global Strategic Business Report? announced by Global Industry Analysts, Inc., provides a comprehensive review of market trends, issues, drivers, company profiles, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections (in US$ Million) for major geographic markets including the United States, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Product segments analyzed include Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD). PVD equipment market is further analyzed by end-use segments such as Microelectronics, Cutting Tools, Industrial/Energy, Specialty Packaging, Storage, Optics, and Medical Markets, while CVD equipment market is analyzed by Microelectronics, Cutting Tools, Industrial/Energy and Medical Markets.
For more details about this comprehensive market research report, please visit ?
http://www.strategyr.com/Thin_Layer_Deposition_Equipment_Market_Report.asp
About Global Industry Analysts, Inc.
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